research student

Joshua Depiver


Postgraduate research student

Joshua Depiver

College

College of Science and Engineering

ORCiD ID

0000-0001-8773-2535

Email

j.depiver@derby.ac.uk

About

I currently work at the College of Science and Engineering. My research involves mechanical and electronics manufacturing engineering, FEA (finite element analysis), engineering materials, reliability testing and modelling and CAD/CAM (computer-aided design and manufacturing). My current project is Thermo-mechanical Reliability Studies of Lead-Free Solder Interconnects.

I am an ambitious and enthusiastic individual with an aptitude for research in Mechanical, Manufacturing, Electronics, and Control Engineering. I collaborate with others to bring forward a set of skills obtained throughout my studies and embrace any opportunities for projects that require developing innovation and research and development in a technically challenging engineering company or academic environment.

I am also a dynamic, team-spirited and performance-inclined experienced engineering professional with an extraordinary blend of leadership, business and manufacturing industry knowledge.

I am acknowledged for a keen intelligence to improve component designs, increase efficiency, and decrease the need for re-engineering.

Thesis title

Thermo-mechanical Reliability Studies of Lead-Free Solder Interconnects.

Supervisor

Teaching responsibilities

Membership of professional bodies

Qualifications

I have won several scholarships and bursaries during my studies for exceptional academic performance.

Additional interests and activities

Awards and Honours:

  1. Best Student Paper Award of International Conference on Electrical Engineering and Applications 2019:
    Paper Title: Creep Response of Various Solders used in Soldering Ball Grid Array (BGA) on Printed Circuit Board (PCB)Certificate of Merit for International Conference on Systems Engineering and Engineering Management 2018 (Co-Authorship)
  2. Certificate of Merit for International Conference on Systems Engineering and Engineering Management 2018 (Co-Authorship)
    Paper Title: Application of Temperature Distribution on Discretized Element of Dried Ginger Using MATLAB PDES for Optimal Preservation. 
  3.  Session Chair - International Conference on Intelligent Automation and Robotics World Congress on Engineering and Computer Science – October 2019. International Association of Engineers (IAENG), Sans Francisco, California, U.S.A.Session Chair - International Conference on Electrical Engineering and Applications
  4. World Congress on Engineering and Computer Science – October 2019. International Association of Engineers, Sans Francisco, California, U.S.A
  5. University of Greenwich – September 2015. Top 1% in MSc Mechanical and Manufacturing Engineering
  6. Speak Out for Engineering Competition – April 2015. Institution of Mechanical Engineers (iMechE) – Finalist in the competition
  7. University of Greenwich Fast Forward Award Program – September 2014. Awarded a MSc scholarship

Recent publications

  1. Depiver, J.A., Mallik, S. and Harmanto, D., 2021. Solder joint failures under thermo-mechanical loading conditions–A review. Advances in Materials and Processing Technologies, 7(1), pp.1-26. 
  2. Adeniyi Depiver, S. Mallik and E. H. Amalu, 2020., "Comparing and Benchmarking Fatigue Behaviours of Various SAC Solders under Thermo-Mechanical Loading," 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC), Tønsberg, Vestfold, Norway, 2020, pp. 1-11.
  3. Depiver, J.A., Mallik, S. & Amalu, E.H., 2020. Effective Solder for Improved Thermo-Mechanical Reliability of Solder Joints in a Ball Grid Array (BGA) Soldered on Printed Circuit Board (PCB). Journal of Elec Materi 50, 263–282.
  4. Gbasouzor A.I., Depiver J., Njoku JE (2020) Temperature Distribution and Boundary Condition on Heat Transfer from Discretized Element of Dried Ginger Rhizome Using MATLAB PDES for Optimal Preservation. In: Ao SI., Kim H., Amouzegar M. (eds) Transactions on Engineering Technologies. WCECS 2018. Springer, Singapore. 
  5. G.A. Ikechukwu, S. Mallik, JEE Njoku, J. Depiver., 2020 "Experimental Analysis of Thin Layer Drying of Ginger Rhizome in Convective Environment", Advances in Science, Technology and Engineering Systems Journal, vol. 5, no. 6, pp. 1132-1142.
  6. Depiver, J.A., Mallik, S., Harmanto, D. and Amalu, E.H., 2019, December. Creep damage of BGA solder interconnects subjected to thermal cycling and isothermal ageing. In 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) (pp. 143-153). IEEE., doi: 10.1109/EPTC47984.2019.9026710.
  7. Joshua A. Depiver, Sabuj Mallik, and Emeka H. Amalu., 2019. "Creep Response of Various Solders used in Soldering Ball Grid Array (BGA) on Printed Circuit Board (PCB)," Lecture Notes in Engineering and Computer Science: Proceedings of The World Congress on Engineering and Computer Science 2019, 22-24 October, San Francisco, USA, pp. 158-166.
  8. Ikechukwu, G.A., Depiver, J. and Njoku, J.E., 2018. Application of Temperature Distribution on Discretized Element of Dried Ginger Using MATLAB PDES for Optimal Preservation. In Proceedings of the World Congress on Engineering and Computer Science (Vol. 2).

Please see my Google Scholar page for further information on my publications.