Staff profile

Sabuj Mallik


Head of Mechanical and Manufacturing Engineering and Deputy Head of Mechanical Engineering and Built

Subject

Mechanical and Manufacturing Engineering

College

College of Engineering and Technology

Department

Mechanical Engineering and the Built Environment

Research centre

Health and Social Care Research Centre

Campus

Markeaton Street, Derby Campus

Email

s.mallik@derby.ac.uk

About

I am Head of Mechanical and Manufacturing Engineering subject area and Deputy Head of Mechanical Engineering and Built Environment Department, within the College of Engineering and Technology. I am leading a team of 23 academics and over 600 students, spanning mechanical, manufacturing and motorsport engineering. I am also an active researcher with research expertise in engineering materials, manufacturing and reliability engineering (with applications in electronics, automotive and aerospace sectors). 

Research interests

My primary research goals are directed towards characterisation and modelling of alloys and soft-solid materials and their processing (with specific reference to automotive, oil and aerospace industries). I have special interests and expertise in the area of the theoretical modelling and experimental study of the flow and deformation behaviour of paste materials (in particular, lead-free solder pastes used in electronics assembly applications). My current research interests also include thermal management using advanced metal matrix composites and reliability engineering – specifically, experimental studies using thermal cycling, highly accelerated life testing and failure analysis; as well as fatigue modelling of solder joints using finite element methods. 

Membership of professional bodies

Qualifications

10/04 – 01/09      PhD in Engineering (with specialisation in materials processing, characterisation and modelling)University of Greenwich, UK

                           PhD Thesis: Study of the Time-dependent Rheological Behaviour of Lead-free Solder Pastes and Flux Mediums used for Flip-Chip Assembly Applications

01/03 – 07/04      MSc (with Distinction) in Mechanical & Manufacturing, University of Greenwich, UK

09/11 – 08/12      Postgraduate Certificate in Higher Education, University of Greenwich, UK

11/96 – 07/01      BSc (First Class 1st with honours, CGPA:3.81/4.00) in Mechanical Engineering, Bangladesh Institute of Technology (BIT), Khulna, Bangladesh.

Recent conferences

  1. Njoku, JE, Mallik, S., Bhatti, R. Amalu, EH., Ogunsemi, B. (2015), “Effects of component stand-off height on reliability of solder joints in assembled electronic component”, European Microelectronics Packaging Conference (EMPC), 1-4
  2. Njoku, JE, Mallik, S., Bhatti, R., Amalu, EH, Ekere, NN (2015), “Effect of component standoff height on thermo-mechanical reliability of ball grid array (BGA) solder joints operating in high-temperature ambient”, 38th International Spring Seminar on Electronics Technology (ISSE), 231-236
  3. Mallik, S., Njoku, J. and Takyi, G. (2014), “Quantitative Evaluation of Voids in Lead FreeSolder Joints , International Conference on Mechanical Properties of Materials (ICMPM), Barcelona, Spain, 18 – 20 Dec 2014.
  4. Mallik, S., Kaiser, F. (2014), “Reliability Study of Subsea Electronic Systems Subjected toAccelerated Thermal Cycle Ageing”, World Congress on Engineering 2014 (WCE 2014), South Kensington campus, Imperial College, London, U.K., 2 – 4 July, 2014.
  5. Mallik, S. and Mehdawi, A. Z. E. (2013), “Evaluating the Mechanical Reliability of Ball GridArray (BGA) Flexible Surface-mount Electronics Packaging under Isothermal Ageing”, World Congress on Engineering 2013 (WCE 2013), South Kensington campus, Imperial College, London, U.K., 3 – 5 July, 2013.

Recent publications

  1. Mallik, S., Njoku, J. and Takyi, G. (2015), “Quantitative Evaluation of Voids in Lead Free Solder Joints”, Applied Mechanics & Materials, 772.
  2. Nath, J., Mallik, S., and Borah, A. (2015), “A Study on the Effect of Ageing and Intermetallic Compound Growth on the Shear Strength of Surface Mount Technology Solder Joints”, Journal of The Institution of Engineers (India): Series D, 96(1), pp. 1-6.
  3. Bernasko, P. K., Mallik, S., and Takyi, G. (2015) "Effect of intermetallic compound layer thickness on the shear strength of 1206 chip resistor solder joint", Soldering & Surface Mount Technology, 27(1), pp.52 – 58.
  4. Thakur, V., Vuppala, V., and Mallik, S. (2015), “CFD Simulation of Solder Paste Flow and Deformation Behaviours during Stencil Printing Process”, International Journal of Recent Advances in Mechanical Engineering, 4(1), pp. 01-13. 
  5. Sharma, A., Mallik, S., Ekere, N. N., and Jung, J. P. (2014), “Printing Morphology and Rheological Characteristics of Lead-Free Sn-3Ag-0.5Cu (SAC) Solder Pastes”, Journal of Microelectronic Packaging Society, 21(4), 83-89.
  6. Ekpu, M., Bhatti, R. Okereke, M. I., Mallik, S., and Otiaba, K. (2014), “The effect of thermal constriction on heat management in a microelectronic application”, Microelectronics Journal, 45 (2), pp. 159-166.
  7. Ekpu, M., Bhatti, R. Okereke, M. I., Mallik, S., and Otiaba, K. (2014), “Fatigue Life of Lead-free Solder Thermal Interface Materials at Varying Bond Line Thickness in Microelectronics”, Microelectronics Reliability, 54 (1), pp. 239-244.
  8. Barnesko, PK, Mallik, S., Takyi, G. (2014), “Effect of reflow profile parameters on surface mount chip resistor solder joint shear strength”, International Journal of Materials Science and Applications 3 (5), pp. 254-259
  9. Kumar, S., Mallik, S., Ekere, N. and Jung, J. (2013), “Stencil Printing Behavior of Lead-Free Sn-3Ag-0.5Cu Solder Paste for Wafer Level Bumping for Sub-100um size Solder Bumps”, Metals and Materials International, 19 (5), pp. 1083-1090.
  10. Mallik, S., Chan, E. H. L. and Ekere, N., (2013), “Nonlinear Viscoelastic Characteristics ofSn-Ag-Cu Solder Pastes Used in Electronics Assembly Applications”, Journal of Materials Engineering and Performance, 22(4), pp. 1186-1193.
  11. Otiaba, KC, Bhatti, RS, Ekere, NN Ekere, Mallik, S., Ekpu, M. (2013), “Finite element analysis of the effect of silver content for Sn–Ag–Cu alloy compositions on thermal cycling reliability of solder die attach”, Engineering Failure Analysis, 28, pp. 192-207
  12. Ekpu, M., Bhatti, R., Okere, MI, Mallik, S., Oiaba, KC. (2013), “Prediction and optimization of design parameters of microelectronic heat sinks”, Journal of Emerging Trends in Engineering and Applied Sciences (JETEAS) 4 (3), pp. 493 – 500.