Staff profile

Dr Sabuj Mallik


Head of Discipline of Engineering

Sabuj Mallik having Professional Conversation with Colleague

Subject

Electrical and Electronic Engineering, Mechanical and Manufacturing Engineering, Motorsport Engineering, Engineering

College

College of Science and Engineering

Department

School of Computing and Engineering

Campus

Markeaton Street, Derby Campus

Email

s.mallik@derby.ac.uk

About

I am Head of Discipline of Engineering within the College of Science and Engineering. I am leading a team of 34 academics and over 1000 students, spanning mechanical, manufacturing, motorsport, electrical & electronics and entertainment engineering. I am also an active researcher with research expertise in engineering materials, manufacturing and reliability engineering (with applications in electronics, automotive, and aerospace sectors).

Research interests

My primary research goals are directed towards characterisation and modelling of alloys and soft-solid materials and their processing (with specific reference to automotive, oil and aerospace industries). I have special interests and expertise in the area of the theoretical modelling and experimental study of the flow and deformation behaviour of paste materials (in particular, lead-free solder pastes used in electronics assembly applications). My current research interests also include thermal management using advanced metal matrix composites and reliability engineering – specifically, experimental studies using thermal cycling, highly accelerated life testing and failure analysis; as well as fatigue modelling of solder joints using finite element methods. 

Membership of professional bodies

Qualifications

10/04 – 01/09      PhD in Engineering (with specialisation in materials processing, characterisation and modelling)University of Greenwich, UK

                           PhD Thesis: Study of the Time-dependent Rheological Behaviour of Lead-free Solder Pastes and Flux Mediums used for Flip-Chip Assembly Applications

01/03 – 07/04      MSc (with Distinction) in Mechanical & Manufacturing, University of Greenwich, UK

09/11 – 08/12      Postgraduate Certificate in Higher Education, University of Greenwich, UK

11/96 – 07/01      BSc (First Class 1st with honours, CGPA:3.81/4.00) in Mechanical Engineering, Bangladesh Institute of Technology (BIT), Khulna, Bangladesh.

07/19 – 08/20      Diploma in Management and Leadership, Level 5, Chartered Management Institute (CMI), UK

Recent conferences

  1. Depiver, J., Mallik, S., Amalu, E. and Harmanto, D. (2019) 'Creep damage of BGA solder interconnects subjected to thermal cycling and isothermal ageing', 2019 21st Electronics Packaging Technology Conference. Singapore, December. IEEE, pp. 1-11
  2. Depiver, J., A., Mallik, S., Amalu, E. H. (2019). 'Creep response of various solders used in soldering ball grid array (BGA) on printed circuit board (PCB)'. World congress on engineering and computer science. San Francisco, 22-24 October. San Francisco, USA, pp158-166
  3. Ikechukwu, G. A., Mallik, S. Dara, and Jude Ezechi, J. (2019) "Determination of Thin Layer Drying Characteristics of Ginger Rhizome Slices at Varied Temperatures," Lecture Notes in Engineering and Computer Science: Proceedings of The World Congress on Engineering and Computer Science 2019, 22-24 October, 2019, San Francisco, USA, pp468-476
  4. Njoku, JE, Mallik, S., Bhatti, R. Amalu, EH., Ogunsemi, B. (2015), “Effects of component stand-off height on reliability of solder joints in assembled electronic component”, European Microelectronics Packaging Conference (EMPC), 1-4
  5. Njoku, JE, Mallik, S., Bhatti, R., Amalu, EH, Ekere, NN (2015), “Effect of component standoff height on thermo-mechanical reliability of ball grid array (BGA) solder joints operating in high-temperature ambient”, 38th International Spring Seminar on Electronics Technology (ISSE), 231-236
  6. Mallik, S., Njoku, J. and Takyi, G. (2014), “Quantitative Evaluation of Voids in Lead Free Solder Joints , International Conference on Mechanical Properties of Materials (ICMPM), Barcelona, Spain, 18 – 20 Dec 2014

Recent publications

  1. Depiver, J, Mallik, S., Amalu, E. (2020), Effective Solder for Improved Thermo-Mechanical Reliability of Solder Joints in Ball Grid Array (BGA) Soldered on Printed Circuit Board (PCB), Journal of Electronic Materials, Accepted for publication
  2. Depiver, J, Mallik, S, Harmanto, D. (2020), “Solder joint failures under thermo-mechanical loading conditions–A review, Advances in Materials and Processing Technologies, 1-26
  3. Mijoh A. Gbededo, M. A., Liyanage, K., Mallik, S. (2018), “Holistic Simulation-Based Impact Analysis Framework for Sustainable Manufacturing, International Journal of Industrial and Manufacturing Engineering, 12(6), pp. 827 – 833
  4. Mallik, S., Njoku, J. and Takyi, G. (2015), “Quantitative Evaluation of Voids in Lead Free Solder Joints”, Applied Mechanics & Materials, 772
  5. Nath, J., Mallik, S., and Borah, A. (2015), “A Study on the Effect of Ageing and Intermetallic Compound Growth on the Shear Strength of Surface Mount Technology Solder Joints”, Journal of The Institution of Engineers (India): Series D, 96(1), pp. 1-6
  6. Bernasko, P. K., Mallik, S., and Takyi, G. (2015) "Effect of intermetallic compound layer thickness on the shear strength of 1206 chip resistor solder joint", Soldering & Surface Mount Technology, 27(1), pp.52 – 58
  7. Thakur, V., Vuppala, V., and Mallik, S. (2015), “CFD Simulation of Solder Paste Flow and Deformation Behaviours during Stencil Printing Process”, International Journal of Recent Advances in Mechanical Engineering, 4(1), pp. 01-13
  8. Sharma, A., Mallik, S., Ekere, N. N., and Jung, J. P. (2014), “Printing Morphology and Rheological Characteristics of Lead-Free Sn-3Ag-0.5Cu (SAC) Solder Pastes”, Journal of Microelectronic Packaging Society, 21(4), 83-89